There has been explosive growth in the performance and consequential adoption of atom probe tomography in the past decade, which was fueled by the development of the commercial local-electrode atom probe (LEAP) and technologies for specimen preparation. The LEAP introduced to atom probes orders-of-magnitude increases in data collection rates and field of view while improving mass resolution and greatly improving ease of use. These developments constitute the second revolution in the field since the invention of the atom probe in 1967 and atom probe tomography in 1973: the invention of the three-dimensional atom probe was the first revolution. This article seeks to put this second revolution into historical perspective by recounting the essential developments that led to this point. In particular, the role of Erwin Müller, the inventor of the atom probe and related instruments, is highlighted. From the invention of the field emission electron microscope to the field ion microscope to the atom probe and beyond, he created a field of microscopy that is thriving today. Next, the state of the art in atom probe instrumentation is illustrated with a current application. Finally, a brief look toward future developments is provided, which may include superconducting detectors and integration of atom probes with transmission electron microscopes.

Phase change materials can be switched rapidly and repeatedly between amorphous and crystalline phases, which differ distinctly in their optical and electrical properties. This combination of properties is utilized to store information in rewritable optical storage media and in emerging phase change memory technology. This article describes the physical properties of phase change materials such as Ge2Sb2Te5 and relates these properties to specific structural and bonding characteristics. Electrical conduction and switching, which are relevant for phase change memory operation, are explained from a physical perspective. Phase change memory device integration and technology development are discussed, including aspects of access device selection and integration.

Resistive memory devices based on organic materials that can be configured to two or more stable resistance states have been extensively explored as information storage media due to their advantages, which include simple device structures, low fabrication costs, and flexibility. Various organic-based materials such as small molecules, polymers, and composite materials have been observed to show bistability. This review provides a general summary about the materials, structures, characteristics, and mechanisms of organic resistive memory devices. Several critical strategies for device fabrication, performance enhancement, and integrated circuit architectures are also discussed.

The phenomenon of electron tunneling has been known since the advent of quantum mechanics, but continues to enrich our understanding of many fields of physics, as well as creating sub-fields on its own. Spin-dependent tunneling in magnetic tunnel junctions has aroused considerable interest and development. In parallel with this endeavor, recent advances in thin-film ferroelectrics have demonstrated the possibility of achieving stable and switchable ferroelectric polarization in nanometer-thick films. This discovery opened the possibility of using thin-film ferroelectrics as barriers in magnetic tunnel junctions, thus merging the fields of magnetism, ferroelectricity, and spin-polarized transport into an exciting and promising area of novel research. Nowadays, this research has become an important constituent of a broader effort in multiferroic materials and heterostructures that involves rich fundamental science and offers a potential for applications in novel multifunctional devices. The purpose of this article is to review recent developments in ferroelectric and multiferroic tunnel junctions. Starting from the concept of electron tunneling, we first discuss the key properties of magnetic tunnel junctions and then assess key functional characteristics of ferroelectric and multiferroic tunnel junctions. We discuss the recent demonstrations of giant resistive switching observed in ferroelectric tunnel junctions and the new concept of electrically controlling the spin polarization in magnetic tunnel junctions with a ferroelectric tunnel barrier.

This article reviews recent progress in understanding the resistive switching (RS) behavior and improvements in device performance of RS metal oxide (MO) thin-film systems and devices. The diverse RS MO materials are classified according to their switching mechanisms and characteristics. For each category, some representative materials are selected, and their characteristics are discussed. In addition, other factors such as the device structure, which also plays a crucial role in determining the device properties, are discussed as well. When applied in a real circuit (e.g., in a crossbar structure), there are device features/characteristics that need to be considered, including the bias polarity for switching, the current-voltage relationship, reliability, and scaling issues. Since nonvolatile RS in many MO materials is primarily associated with localized conduction channels, understanding the nature and the dynamic change of the current path structure is crucial and therefore is reviewed at length here. Guidelines for the choice of materials and access devices and their fabrication methods will also be provided. Finally, this review concludes with the outlook and challenges of MO-based resistance change devices for semiconductor memories.

Resistive switching, the reversible modulation of electronic conductivity in thin films under electrical stress, has been observed in a wide range of material systems and is attributed to diverse physical mechanisms. Research activity in this area has been traditionally fueled by the search for a perfect electronic memory candidate but recently received additional attention due to a number of other promising applications, such as reconfigurable and neuromorphic computing. This issue of MRS Bulletin is devoted to current state-of-the-art understanding of the physics behind resistive switching in several major classes of material systems and their intrinsic scaling prospects in the context of electronic circuit applications. In particular, the goal of this introductory article is to review the most promising applications of thin-film devices and outline some of the major requirements for their performance.