Atomic layer deposition (ALD) uses self-limiting chemical reactions between gaseous precursors and a solid surface to deposit materials in a layer-by-layer fashion. This process results in a unique combination of attributes, including sub-nm precision, the capability to engineer surfaces and interfaces, and unparalleled conformality over high-aspect ratio and nanoporous structures. Given these capabilities, ALD could play a central role in achieving the technological advances necessary to redirect our economy from fossil-based energy to clean, renewable energy. This article will survey some of the recent work applying ALD to clean energy conversion, utilization, and storage, including research in solid oxide fuel cells, thin-film photovoltaics, lithium-ion batteries, and heterogenous catalysts. Throughout the manuscript, we will emphasize how the unique qualities of ALD can enhance device performance and enable radical new designs.

We report a breakthrough in the field of electrolyte additives for use in lithium ion batteries. Batteries containing maleimide (0.1 wt%) as an electrolyte additive absorbed moisture (H2O) from a high-humidity atmosphere. When compared with batteries without the maleimide and absorbed moisture, the capacity of batteries with the “binary additive” showed improvements of 7.4% and 5.2% in a 0.1C/0.1C cycle test, and 394% and 174% in high-power 3C rate tests conducted at room temperature and 55 °C, respectively. Thus, this innovative additive formation can effectively reduce the requirement for anhydrous conditions during the fabrication and operation of lithium ion batteries.

As applications of atomic layer deposition (ALD) in emerging areas such as nanoelectronics, photovoltaics, and flexible electronics expand beyond single-wafer semiconductor processing, there is a growing need for novel approaches to integrate new process designs, substrate materials, and substrate delivery methods. An overview is given of new means to extend the capabilities of ALD and to improve the speed and simplicity of ALD coatings using new reactor designs. These include energy-enhanced and spatial ALD schemes involving plasma, direct-write, atmospheric pressure, and roll-to-roll processing. The long-term goal of this work is to integrate viable high-throughput capabilities with ALD processes.

Over the past 10 years, the number of materials that can be processed by atomic layer deposition (ALD) has expanded rapidly. Significant progress has been seen in ALD of high-κ oxides, ternary oxides, and noble metals, which have been studied quite extensively. High-κ oxide processes are used today in various industrial applications. However, many new applications are pushing the need for less common compounds, and therefore new processes are being developed (e.g., for fluorides, Li containing compounds, and phosphates). New ALD processes require new designs for volatile precursors to deliver elements with ligands that ensure self-limiting surface reactions. In addition to inorganics, new polymeric and inorganic-organic hybrid materials are opening new frontiers for ALD, including expansion of the process to include molecular layer deposition. A combination of inorganic and organic parts in the deposited layers offers expanding opportunities for tailoring materials properties.