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We describe aspects of transmission electron microscopy (TEM) technique to image and quantify the defect state following neutron or ion irradiation with an emphasis on experimental considerations. After outlining various neutron and ion irradiation scenarios, including some sample preparation suggestions, we discuss methods to measure defect densities, size distributions, structures, and interstitial or vacancy nature. The importance of the image simulations of Zhou is suggested for guidance to the most accurate quantification of the defect state. It is hoped that the usefulness of the present paper will be greatest for those experiments that compare defect states in materials after different irradiation conditions, or especially those studies designed to benchmark advanced computer model simulations of defect production and evolution. The successful simulation of the defect state in bulk samples neutron irradiated to high dose at high temperature is a goal to which the suggestions in this paper can contribute.
InGaN/GaN green light-emitting diodes (LEDs) have been prepared by metal-organic chemical vapor deposition with various growth temperatures for p-GaN layer. The structural and optoelectronic properties of as-grown multiple quantum wells (MQWs) and LEDs are studied in detail. It reveals that with the growth of p-GaN layer, the crystalline qualities of the as-grown n-GaN layer are improved significantly, while the optoelectronic properties of MQWs are decreased dramatically. Furthermore, the mechanisms for the effect of p-GaN growth temperature on the properties of InGaN/GaN green LEDs are proposed. It is demonstrated that the p-GaN layer grown at a suitable temperature of 950 °C shows the highest optoelectronic properties due to the fact that this suitable temperature for p-layer growth is good for the Mg doping and would not cause the fluctuation of indium in the MQWs, and eventually benefits to the effective recombination of carriers. This work provides an optimized p-GaN layer growth temperature for realizing highly efficient InGaN/GaN green LED devices.
The erosion–corrosion properties and interface microstructure of a Fe–B alloy that contains 3.5 wt% B in flowing liquid zinc have been investigated by electron backscattered diffraction, x-ray diffraction, and scanning electron microscopy to clarify the flowing effect of liquid zinc on erosion performance using a rotating-disk technique. The Fe–B alloy erodes at a low and steady rate in flowing liquid zinc. Flowing liquid zinc can accelerate the iron and zinc mass transfer to form Fe–Zn compounds and promote the removal of loose FeZn13. Much residual corrosion-resistant Fe2B and some erosion products coexist at the erosion interface because of the chemical and micromechanical effects that are created by flowing liquid zinc. The failure of the Fe2B corrosion-resistant skeleton in flowing liquid zinc occurs because of the loss of supporting matrix and also the formation and spread of microcracks during erosion.
Some Fe-rich amorphous alloys of Fe–B–P–Si and Fe–B–P–Si–C systems were found to exhibit simultaneously good soft magnetic properties with high-saturation magnetization values near 1.7 T, which are higher than those for previously reported Fe-based amorphous and glassy alloys, in addition to rather good amorphous ribbon formability, good bending ductility, and rather high corrosion resistance. The corrosion resistance increased with increasing P content, accompanying by the increase in thermal stability of the amorphous phase. The decrease in the outer surface velocity of the wheel, which results in the increase of ribbon thickness, also causes an improvement of surface smoothness of the melt-spun amorphous alloy ribbons. The syntheses of new high-saturation Fe-based soft magnetic amorphous alloys without any other transition metals hold promise for future extension of Fe-based soft magnetic amorphous materials.
The high cost of single-crystal III–V substrates limits the use of gallium arsenide (GaAs) and related sphalerite III–V materials in many applications, especially photovoltaics. However, by making devices from epitaxially grown III–V layers that are separated from a growth substrate, one can recycle the growth substrate to reduce costs. Here, we show damage-free removal of an epitaxial single-crystal GaAs film from its GaAs growth substrate using a laser that is absorbed by a smaller band gap, pseudomorphic indium gallium arsenide nitride layer grown between the substrate and the GaAs film. The liftoff process transfers the GaAs film to a flexible polymer substrate, and the transferred GaAs layer is indistinguishable in structural quality from its growth substrate.
Two series of zirconium samples were investigated by neutron and X-ray diffraction. First series of the samples was deformed at room temperature (RT), whereas the second series was deformed at 300 °C. Both series were deformed on uniaxial tensile machine INSTRON 5882 from strain 0 to 30% (strain step was 5%). The neutronographic texture measurements were performed on the KSN-2 neutron diffractometer located at the research reactor LVR-15 in the Nuclear Research Institute, plc. Rez, Czech Republic. The X-ray measurements were performed at the theta/theta X'Pert PRO diffractometer with the Cr X-ray tube. Observed data were processed by the software packages GSAS and X'Pert Texture. Preferential orientation of the $\left({10\bar 10} \right)$ and $\left({11\bar 20} \right)$ plane poles is found to be parallel to the rolling direction for both tested deformation series. Poles of the $\lpar 10\bar 12\rpar $ and $\lpar 10\bar 13\rpar $ planes tend to be parallel to the normal direction (Tables II and III). Orientation of the basal poles is tilted by 45° from the normal direction toward the transverse direction. Sharpness of the resulting texture increases with extends of the applied deformation as well as with rise of the tensile test temperature from the RT level to 300 °C.
The production of aluminum nitride (AlN) from aluminum metal was investigated in this study. The nitridation of Al (in rod, powder, and thin-plate forms) was facilitated by dissolving the Al2O3 thin films formed on the Al samples with a molten fluoride mixture (KF–45 mol% AlF3, KF, or LiF–50 mol% KF). AlN was formed when NH3 gas was supplied to the Al sample (in both solid and liquid forms) wetted by molten fluoride mixture. The lowest temperature at which AlN was successfully produced was 773 K. No AlN was formed when N2 or H2–25% N2 gas was supplied to the Al sample, even when a molten fluoride mixture was used. The reaction rate for the nitridation of Al powder increased with the temperature and reached 99% after 3 h at 1173 K. AlN thin films of 2–5 μm thickness were formed on Al thin plates (0.075–1.0 mm thick) at 873 K.
Single-crystalline diamond plates were implanted by He+ ions with a set of energies and fluences that ensure uniform radiation damage (RD) in a 670-nm-thick layer. Implantation is carried out at a wide range of fluences, which allows one to cover the range of RD levels from very low to complete graphitization of diamond. Using the measurement data on the bending of diamond plates and the surface swelling of the ion-implanted material, we calculate the mechanical stress and the density of diamond for various levels of RD. Diamonds with various levels of RD are investigated by the Raman scattering and optical transmission methods. We establish that, above the graphitization threshold, the diamond phase almost completely disappears as the RD level increases, while the fraction of sp2 material sharply increases. Such a material is unexpectedly ductile. It cannot be restored to diamond even by annealing under a pressure corresponding to thermodynamic stability of diamond.