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Improvement of both solution and vapor-phase synthetic techniques for nanoscale ferroelectrics has fueled progress in fundamental understanding of the polar phase at reduced dimensions, and this physical insight has pushed the boundaries of ferroelectric phase stability and polarization switching to sub-10 nm dimensions. The development and characterization of new ferroelectric nanomaterials has opened new avenues toward future nonvolatile memories, devices for energy storage and conversion, biosensors, and many other applications. This prospective will highlight recent progress on the synthesis, fundamental understanding, and applications of zero- and one-dimensional ferroelectric nanomaterials and propose new directions for future study in all three areas.
This paper aims to obtain an analytical expression for the ratio of unloading work of indentation (Wu) to total loading work of indentation (Wt) (work recovery ratio of indentation) in instrumented spherical indentation. The expanding cavity model and Lamé solution are used. Three typical stress–strain relations (elastic-perfectly plastic, linear hardening, and power-law hardening) are analyzed. The results of finite-element method coincide with the expressions. The expressions show that the work recovery ratio of indentation is just related to plastic parameters. Furthermore, elastic work (We) are obtained, and it is proved that We should be distinguished from Wu in spherical indentation.
Hybrid inorganic–organic perovskites have emerged over the last 5 years as a promising class of materials for optoelectronic applications. Most notably, their solar cells have achieved power conversion efficiencies above 20% in an unprecedented timeframe; however, many fundamental questions still remain about these materials. This Prospective Article reviews the procedures used to deposit hybrid perovskites and describes the resulting crystallographic and morphological structures. It further details the electrical and optical properties of perovskites and then concludes by highlighting a number of potential applications and the materials challenges that must be overcome before they can be realized.
Three-dimensional (3D) integration has emerged as a potential solution to the wiring limits imposed on chip performance, power dissipation, and packaging form factor beyond the 14 nm technology node. In 3D integrated circuits (ICs), the through-silicon via (TSV) is a critical element connecting die-to-die in the integrated stack structure. The thermal expansion mismatch between copper (Cu) vias and silicon (Si) can induce complex stresses in TSV structures to drive interfacial failure and Cu extrusion, degrading the performance and reliability of 3D interconnects. This article reviews current studies on thermal stresses and their effects on reliability of TSV structures. Recent results from measurements of stress and plasticity characteristics of Cu TSV structures are reviewed, including wafer curvature, micro-Raman spectroscopy, and synchrotron x-ray microdiffraction techniques. The effects of the Cu microstructure on stress and reliability, particularly on via extrusion and the device keep-out zone in TSV structures, are discussed. Based on the analysis of the reliability impact, we explore the potential of material and processing optimization to build reliable TSV structures for 3D ICs.
The field of plasmonics has transformed the ability to control nanoscale light-matter interactions with applications ranging from high-efficiency photovoltaic modules to ultrasensitive biodetectors, electromagnetic cloaks, and subwavelength integrated photonic circuits. This article summarizes my group’s efforts to contribute to this burgeoning field, with emphasis on our research in quantum plasmonics and optical-frequency magnetism. First, we explore the plasmon resonances of individual nanoparticles as they transition from a classical to a quantum-influenced regime. We then utilize these results to directly monitor hydrogen absorption and desorption in individual palladium nanocrystals. Subsequently, using real-time manipulation of plasmonic particles, we investigate plasmonic coupling between pairs of particles separated by nanometer- and angstrom-scale gaps. For sufficiently small separations, we observe the effects of quantum tunneling between particles on their plasmonic resonances. Finally, using the properties of coupled metallic nanoparticles, we demonstrate the colloidal synthesis of an isotropic metafluid or “metamaterial paint” that exhibits a strong optical-frequency magnetic response and the potential for negative permeabilities and negative refractive indices.
What musical notes can a molecule play? Carbyne is a chain of atoms that vibrates similar to an elastic string. Like the tuning of a guitar string, this vibration can be predicted based on length and tension. Using atomistic simulation, we determine the vibrational response of carbyne. We further produce audible notes, enabling specific musical composition with prescribed molecular conditions (pre-strain and length) and combine single chains into multi-chain systems to form molecular chords. Since the tension of a molecular chain is relatively low (<nN), such “strings” can potentially be developed for signaling and detection with high resolution.