The stress relaxation and failure behavior of Ni/Sn–3.0Ag–0.5Cu/electroless nickel electroless palladium immersion gold flip-chip solder bumps undergoing electromigration (EM) at 150 °C under 1.5 × 104 A/cm2 was investigated in situ. Three modes of stress relaxation of Sn–3.0Ag–0.5Cu solder bumps were identified. At the cathode, voids and hollows with terrace morphology gradually formed to relieve the tensile stress; at the anode, especially around the current crowding corner, recrystallization of Sn grains and extrusion of hillocks occurred to relieve the compressive stress; in the solder bump, Sn grain boundary sliding that occurred to accommodate the diffusion creep was more pronounced with increasing EM time. Grain boundary sliding is considered to be an indispensable requisite for diffusion creep. The microstructural evolution of solder bumps at the last stage of lifetime was revealed, and the final EM-induced failure mode was the local fusion of a solder bump resulting from the crack formation-and-propagation at the cathode.

Translucent, polycrystalline YAG:Ce disks with 0.1, 0.5, and 1 mol% concentrations of cerium as well as different resulting thicknesses of 0.5 and 0.8 mm were prepared by reaction sintering of yttria, alumina, and cerium oxide under vacuum at a temperature of 1800 °C. The obtained samples displayed a microstructure with a Y3Al5O12 main phase interrupted by an intended scattering phase of alumina. Furthermore, the total forward transmittance was between 75 and 78% with the typical absorption bands of cerium at wavelengths of 330 and 460 nm. Phosphor conversion light-emitting diodes (LEDs) with 0.88 W power dissipation have been prepared from these YAG:Ce ceramic disks as converters and blue 455 nm LED chips for excitation. Their color coordinates in the CIE (Commission Internationale de l’Eclairage) diagram determined by spectral photometry depend on the concentration of the Ce dopant and the ceramic converter thickness. The highest luminous flux of 276 lm with an efficiency of 76.6 lm/W was measured for a converter with 0.5 mol% dopant concentration and 0.8 mm thickness emitting a yellowish white light.

Ceramic wafers of alumina (Al2O3) were produced by tape casting of aqueous slurry followed by vacuum sintering. The binder system used to form the tape casting slurry is a copolymer of isobutylene and maleic anhydride, which is environmentally friendly, marketed under the name ISOBAM. The rheological properties of the slurries were studied by varying solid loading and binder addition level. Through the optimization of plasticizer addition, green tapes were casted with excellent plasticity and a thickness of 240–740 μm. The tapes displayed a post-sintering thickness of 150–660 μm. The morphologies, as well as the fracture surface and the as-sintered surface of the powder were examined using a scanning electron microscope (SEM). The in-line transmittance of the transparent unpolished Al2O3 wafers with a thickness of 660 μm was found to be 72% at a wave length of 5 μm and 26% at a wave length of 600 nm.

Plasmonic Ag nanoparticles (AgNPs) with narrow distribution were successfully loaded on graphitic carbon nitride (g-C3N4) sheet by thermal polymerization of melamine precursor and a simple wet-chemical pathway in the presence of polyvinylpyrrolidone (PVP). N,N-dimethylformamide (DMF) was used as an efficient reducing agent as well as a solvent and its presence facilitated homogeneous distribution of AgNPs under mild reaction condition and easy control of its particle growth under different precursor amounts. Ag/g-C3N4 composites of different Ag content were prepared, and the phase, chemical structure, morphologies, electronic and optical properties of Ag/g-C3N4 heterostructures were well characterized, respectively. The photocatalytic activity of Ag/g-C3N4 composites was evaluated by the decolorization of methyl orange (MO), and they exhibited superior photocatalytic activity to bulk g-C3N4 under visible-light irradiation. Influence of Ag content to photocatalytic activity was also discussed and possible mechanism was explored based on the analysis of photoluminescence spectra (PL) and photodecoloration activity.

Phonons—quanta of crystal lattice vibrations—reveal themselves in electrical, thermal, optical, and mechanical phenomena in materials. Phonons carry heat, scatter electrons, and affect light–matter interactions. Nanostructures opened opportunities for tuning the phonon spectrum and related properties of materials for specific applications, thus realizing what was termed phonon engineering. Recent progress in graphene and two-dimensional van der Waals materials has led to a better understanding of phonon physics and created additional opportunities for controlling phonon interactions and phonon transport at room temperature. This article reviews the basics of phonon confinement effects in nanostructures, describes phonon thermal transport in graphene, discusses phonon properties of van der Waals materials, and outlines practical applications of low-dimensional materials that rely on phonon properties.

Compression loading on CrN/Cu/Si(100) micropillars containing 45°-inclined interfaces yielded unequivocal evidence of shear plastic flow within Cu thin films confined between non-deforming Si and CrN. Confined shear plastic flow occurred over Cu thicknesses between ~100 and 1200 nm, with a monotonically increasing flow stress as the thickness decreases. The demonstration of a significant dependence of the shear flow stress on the confined Cu film thickness offers a new example of scale-dependent plasticity, and a new experimental test case for non-local plasticity theories.

Electrochemical ceramic cells such as solid-oxide fuel cells (SOFCs) are typically operated at 700–800°C in order to realize practical performances that, in turn, result in higher efficiencies compared to that of other types of electrochemical cells. High-temperature operation, on the other hand, leads to increased system cost and limits application. Thus, lowering the operating temperature is expected to solve such problems. This article shows the effectiveness of redesigning the cell structure for reduction of the operating temperature to 650°C or lower using conventional SOFC materials. A microtubular cell design is found to be one means of lowering the operating temperature of SOFCs. Such developments in fabrication technology are key to realizing high-performance cells with a thin electrolyte and controlled electrode microstructures.

Surfaces and interfaces determine the performance and long-term durability of solid-oxide fuel cells (SOFCs). In most cases, the surface chemical composition of the materials used in these electrochemical energy conversion devices shows significant deviations from the bulk chemistry. This might be as a result of surface cation segregation processes, as well as long-term surface poisoning due to external impurities. Both processes have implications for the electrochemical performance of the devices, leading to the degradation of the cell components. In order to suppress this degradation, an effort to lower the operation temperature to 500–800°C has been made. This article provides an overview of present research progress related to surface segregation and poisoning for low-temperature SOFCs.

Robust superhydrophobic surfaces can improve the performance of various applications. Considerable research has focused on developing superhydrophobic surfaces, but in these studies, superhydrophobicity was attained using polymeric materials, which deteriorate under harsh environments. Recently, it has been shown that rare-earth oxide ceramics are hydrophobic and since they are ceramics, they withstand harsh environments including high temperature. Here we fabricate a superhydrophobic surface by texturing a ceria pellet using laser ablation. We demonstrate water repellency by showing an impinging water droplet bouncing off the surface. This study extends the possibility of producing robust superhydrophobic ceramics using accessible techniques for industrial applications.

Thin-film solid-oxide fuel cells (TF-SOFCs) fabricated using microelectromechanical systems (MEMS) processing techniques not only help lower the cell operating temperature but also provide a convenient platform for studying cathodic losses. Utilizing these platforms, cathode kinetics can be enhanced dramatically by engineering the microstructure of the cathode/electrolyte interface by increasing the surface grain-boundary density. Nanoscale secondary ion mass spectrometry and high-resolution transmission electron microscopy studies have shown that oxygen exchange at electrolyte surface grain boundaries is facilitated by a high population of oxide-ion vacancies segregating preferentially to the grain boundaries. Furthermore, three-dimensional structuring of TF-SOFCs enabled by various lithography methods also helps increase the active surface area and enhance the surface exchange reaction. Although their practical prospects are yet to be verified, MEMS-based TF-SOFC platforms hold the potential to provide high-performance for low-temperature SOFC applications.